Reworkable Edgebond Adhesives
Ruggedize and raise board level reliability
Anisotropically Conductive Adhesives
Electrically interconnect and ground
Electrically Conductive Adhesives
Die attach and general electronics assembly
Thermally Conductive Adhesives
Dissipate heat
Non-Conductive Pastes (NCP)
Attach RFID and smartcard flip chip IC’s
Optoelectronics Adhesives
Assemble optical fiber, connectors, ferrules, VCSEL and Bragg Grating
Ultra-Low Stress Adhesives
Bond stress sensitive devices
Underfill Encapsulants
Raise board level reliability for high reliability applications
Reworkable Underfill Encapsulants
Ruggedize and raise board level reliability
UV Curable Glob Top and Dam-and-Fill Encapsulants
Encapsulate wirebonded IC’s
The CeraTek 12-MPK/2 and 24-MPK/2 are the first constant heat sealer/cutter systems for medical pouches, allowing medical device manufacturers to combine medical pouch sealing and cutting processes into one step following sterilization. The systems are CE and ISO 11607 compliant.
The DDS/2 Vacuum Chamber Hot Bar Pouch Sealer was specifically engineered by SencorpWhite to answer the demand for a machine with the industry’s most advanced vacuum capabilities, the repeatability of a hot bar sealer, and the reliability of the SencorpWhite brand name.
SencorpWhite is the industry leader in the design and manufacture of thermoforming and sealing machinery.
The APM is Engineered to be the most reliable and repeatable pouch sealing system on the market for producing verified sealed pouches. Independent asynchronous carriages allow for the addition of multiple optional functionality such as seal Inspection, Print and Apply, RFID readers, Label Inspection etc.
Our support team are available to help you install & fix technical issues.
We pride ourselves for our customer service.
We have decades of experience as Technical Distributors of manufacturing equipment
